PET release film
This versatile release film is perfectly suited for the production of multilayer printed circuit boards, flexible circuits, and insulating materials.
Its release properties surpass most synthetic materials, such as epoxy, melamine, and phenolic resins, while also boasting high elasticity and tensile strength.
The film is ideal for moulding under pressure up to 210 °C and is coated on both sides with an inorganic silicon compound, while maintaining its release properties.
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